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Here we introduce you how to use CELPURGE to maximize its
effectiveness.
Backpressure in Injection Molding Machines
One method commonly used to purge injection molding machines
involves applying backpressure to discharge the purging
compound from the nozzle. However, this method is not very
effective when using CELPURGE. Rather, the most important
point when cleaning injection molding machines with CELPURGE is to
not apply backpressure.
In order to achieve superior
self-purging performance, CELPURGE includes components
that generate a powerful “expansion action.” The
key point in maximizing this expansion is to
not apply backpressure and to not
flush CELPURGE, so that it can
lift off the contaminations adhering to metal surfaces.
Naturally the application of backpressure does have a cleaning
effect, but in this case results in unnecessary
consumption of purging compound.
The method of “applying backpressure
to discharge the purging compound from the nozzle” may
be an effective one for the semimolten
type compounds.
Semimolten types are frequently used due to their ability
to scour away deposits, but have the disadvantage of being
difficult to be purged.
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| Applying backpressure
to flush CELPURGE
from the nozzle: difficult to remove
Contamination with scouring action alone |
Without applying backpressure, CELPURGE is not flushed
from the nozzle: Contamination lifted off through “expansion
action” |
Setting Up the Molding Machine
Here we show you a standard setup for cleaning of a molding
machine. Please also refer to the page of “Recommendable
Cleaning Process.”
For performing the standard
cleaning, consecutively perform the “1st Cleaning/Basic
Cleaning” and the “2nd Cleaning/Nozzle
Cleaning.” By performing the cleaning in two
stages, you can minimize the amount of CELPURGE used
and save money.
[ 1st Cleaning/Basic Cleaning ]
- metering position
: 70% of maximum
- Number of shots : 5 –10 shots
- Screw rotation speed : 70% of maximum
(Be sure that
torque is not too high.)
- Injection pressure : 70%
of maximum
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Injection speed : 70% of maximum |
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[ 2nd Cleaning/Basic Cleaning ]
- metering position
: ca. 30mm
- Number of shots : > 15 shots |
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